Kinetics of Sn electrodeposition from Sn(II)–citrate solutions
By Han, Chunfen; Liu, Qi & Ivey, Douglas G.
Published in Electrochimica Acta
2008
Abstract
The influence of solution chemistry on the electrodeposition of Sn from Sn(II)–citrate solutions is studied. The distribution of various Sn(II)–citrate complexes and citrate ligands is calculated and the results presented as speciation diagrams. At a SnCl2·H2O concentration of 0.22 mol/L and citrate concentration from 0.30 mol/L to 0.66 mol/L, SnH3L+ (where L represents the tetravalent citrate ligand) is the main species at pH below about 1.2 and SnHL- is the main species at pH above about 4. Polarization studies and reduction potential calculations show that the Sn(II)–citrate complexes have similar reduction potentials at a given solution composition and pH. However, the Sn(II)–citrate complexes become more difficult to reduce with higher total citrate concentration and higher solution pH. Nevertheless, SnHL- which forms at higher pH is a favored Sn(II)–citrate complex for Sn electrodeposition due to better plated film morphology, likely as a result of its slower electroplating kinetics. Precipitates are formed from the Sn(II)–citrate solutions after adding hydrochloric acid (to lower the pH). Compositional and structural analyses indicate that the precipitates may have the formula Sn2L.