Investigations of solution variables in a contactless copper electrodeposition process for 3D packaging applications
By C. Weber and Z. Patterson and M. Zhao and R. Balachandran and R. Gouk and S. Verhaverbeke and F. Shadman and M. Keswani
Published in Materials Science in Semiconductor Processing
2015
Abstract
A novel electrochemical method for contactless electrodeposition of copper onto silicon wafers has been investigated. Deposition parameters such as applied current, concentrations of deposition solution and supporting electrolyte were optimized to achieve high deposition rates as well as homogenous deposition of copper. Copper sulfate solution temperature of about 65