Hexagonal Boron Nitride: The Thinnest Insulating Barrier to Microbial Corrosion
By Chilkoor, Govinda; Karanam, Sushma Priyanka; Star, Shane; Shrestha, Namita; Sani, Rajesh K.; Upadhyayula, Venkata K.K.; Ghoshal, Debjit; Koratkar, Nikhil A.; Meyyappan, M.; Gadhamshetty, Venkataramana
Published in ACS Nano
2018
Abstract
We report the use of a single layer of two-dimensional hexagonal boron nitride (SL-hBN) as the thinnest insulating barrier to microbial corrosion induced by the sulfate-reducing bacteria Desulfovibrio alaskensis G20. We used electrochemical methods to assess the corrosion resistance of SL-hBN on copper against the effects of both the planktonic and sessile forms of the sulfate-reducing bacteria. Cyclic voltammetry results show that SL-hBN-Cu is effective in suppressing corrosion effects of the planktonic cells at potentials as high as 0.2 V (vs Ag/AgCl). The peak anodic current for the SL-hBN coatings is ?36 times lower than that of bare Cu. Linear polarization resistance tests confirm that the SL-hBN coatings serve as a barrier against corrosive effects of the G20 biofilm when compared to bare Cu. The SL-hBN serves as an impermeable barrier to aggressive metabolites and offers ?91% corrosion inhibition efficiency, which is comparable to much thicker commercial coatings such as polyaniline. In addition to impermeability, the insulating nature of SL-hBN suppresses galvanic effects and improves its ability to combat microbial corrosion.